Semiconductor Industry

Industry Overview

The semiconductor and display industry is at the core of global technological innovation, supporting everything from computing and communications to automotive and AI. As chip nodes shrink, packaging diversifies, and display technology evolves (OLED, MicroLED, flexible screens), manufacturing faces unprecedented demands for precision, cleanliness, and material adaptability.

Laser processing—known for its non-contact, ultra-precise, and minimal thermal damage characteristics—has become indispensable in key stages of semiconductor and display manufacturing.

Industry Challenges

• Micron to nanometer-level precision required for wafers, PCBs, and thin-film layers

• Extreme cleanliness and contamination control in Class 100/1000 cleanroom environments

• Delicate materials (Si wafers, glass, polymers, coatings) with low heat tolerance

• Complexity of packaging technologies (BGA, CSP, SiP, Fan-Out, 2.5D/3D ICs)

• Increasing demand for traceability, miniaturization, and flexible processing

Laser Solutions for the Semiconductor Industry

Laser Marking for Chip & Wafer Traceability

• Applications: Wafer backside marking, IC package QR/barcode engraving

• Advantages: Zero contact, ultra-small character marking, non-damaging to circuits

• Recommended Products: UV Laser Marking Machine, CO₂ Glass Laser Marker

Laser Dicing & Cutting Solutions

• Use Cases: Wafer dicing, glass panel cutting, flexible display separation

• Benefits: Ultra-thin material cutting, minimal burrs, no contamination

• Recommended Products: Femtosecond Laser Dicing System, UV Laser Glass Cutter

Laser Drilling & Micromachining

• Applications: Micro-hole drilling in PCBs, via holes in flexible circuits, display panel perforation

• Advantages: Precision drilling down to tens of microns, applicable to ceramics, glass, PI films

• Recommended Products: Picosecond/Femtosecond Laser Micromachining Platform

Laser Cleaning for Precision Surfaces

• Use Cases: Oxide layer removal on wafer contacts, mask cleaning, organic residue removal

• Process Benefits: Non-abrasive, zero solvent use, suitable for automated production lines

• Recommended Products: UV Laser Cleaning Machine, Femtosecond Laser Surface Cleaner

Why Choose Us?

• Cleanroom-Ready Equipment: Built for Class 1000 and below environments

• Ultra-Precision Engineering: Compatible with micron/nanometer-level applications

• Multi-Material Adaptability: Supports Si, GaN, glass, ceramics, flexible films, etc.

• Real-Time Visual Alignment: Integrated CCD/AI vision for marking, drilling, and cutting

• Customizable Solutions: Full-system or modular units tailored to process and yield requirements

Application Examples

Industry Trends

• Advanced Packaging on the Rise: Laser’s ability to work with ultra-fine structures supports next-gen 2.5D/3D ICs

• Flexible & Foldable Displays: Demands laser’s contact-free cutting and high adaptability

• Mini/MicroLED Production Growth: Requires precise laser dicing and selective removal

• Green Clean Manufacturing: Laser cleaning becomes mainstream over wet chemical cleaning

Our Cooperation Models

• Provide complete laser systems or custom modular units

• Support technical guidance, installation & commissioning, and in-depth training

•  Offer OEM/ODM collaboration models to meet production, branding, or R&D needs

Let’s Build the Future of Chips and Displays Together

Whether you’re producing high-volume wafers or precision OLED screens, our laser solutions ensure accuracy, efficiency, and innovation. Contact us to explore how we can support your process nodes, substrates, and production scale with customized laser systems.