| Laser Wavelength: 355 nm |
| Minimum Spot Size: 5 μm |
| Galvanometer Scanning Speed: 0-8000 mm/s |
| Galvanometer Repeatability: ±1 μm |
| Motion mechanism |
| XY module repeat positioning accuracy <±1μm |
| Rotary table repeat positioning accuracy 士2.5″ |
| Lifting platform repeat positioning accuracy <±1μm |
| Wafer-specific automatic loading and unloading mechanism |
| Measurement system |
| Resistance adjustment range: 10Ω–1MΩ |
| Resistance adjustment accuracy: <±0.3% |
| Standard configuration: 24 measurement channels |
| Power requirements |
| Equipment power supply: 220V, 50Hz (single-phase) |
| Air supply pressure: 0.4–0.6 Mpa |
| Ambient temperature: 24±4°C; air-conditioned constant temperature |
mt350 series | high-precision laser trimming for semiconductor wafer processing
Discover the MT350 Series laser trimming machine designed for semiconductor wafer processing with precise trimming capabilities, visual identification, and data collection features. Available for 4″, 6″, and 8″ wafers, it offers high accuracy and efficient production.
The MT350 Series Laser Trimming Machine is engineered for precision semiconductor wafer processing, making it ideal for applications that require high accuracy and efficiency. Compatible with 4-inch, 6-inch, and 8-inch wafers, the MT350 offers unmatched flexibility and performance.
Key features include:
- Advanced Visual Identification and Positioning: Equipped with advanced visual recognition and positioning technology, the MT350 enables full wafer preview and precise trimming with flexible positioning for complex wafer designs.
- Data Collection & Yield Statistics: Provides detailed production insights, including efficiency metrics and quality tracking, helping to optimize throughput and quality control.
- Defective Product Marking: The system can automatically identify defective areas and mark them for easy exclusion, improving overall product quality and yield.
- Automatic Wafer Handling: Featuring an automated loading and unloading system, the MT350 reduces manual intervention, increasing production speed and minimizing handling errors.
- Ultra-High Precision: Leveraging high-speed scanning galvanometers and precision modules, the MT350 achieves trimming accuracy of <±0.3%, ensuring the highest standard of precision.
- 355 nm Laser Source: Standard with a 355 nm laser, but customizable with other laser types (e.g., UV or fiber lasers) to meet specific application needs.
- GBIP Expansion Interface: With the GBIP expansion interface, the MT350 can connect to external measurement devices, offering greater flexibility and functionality for diverse trimming applications.
Optimize your semiconductor production with the MT350 Series, designed for precision, accuracy, and efficiency in wafer trimming. Whether you’re processing standard wafers or specialized materials, the MT350 Laser Trimming Machines delivers high-performance results.
Why Choose the MT350 Series Wafer Laser Trimming Machine?
Decades of expertise in semiconductor laser processing equipment
Proven reliability in 24/7 production environments
Customizable configurations for specific wafer types and materials
ISO-certified quality and global technical support
Seamless integration with existing semiconductor manufacturing lines
Whether for prototype development or mass wafer production, the MT350 Series Wafer Laser Trimming Machine provides unmatched precision, speed, and stability. It’s the ideal choice for manufacturers looking to enhance yield, consistency, and production efficiency.
Contact us today to learn how the MT350 Series Semiconductor Wafer Trimming System can optimize your wafer processing line and deliver next-generation precision performance.
After Sales Service
1.All of our machine will be fully-checked by our quality control department before the shipment.We guarantee all of our laser machines have a one-year warranty (quick-wear parts notincluded).
2.Training details: operation principles, system and structure, safety and maintenance, softwarethe processing technique, and so on.
3.Numerous feedback from our clients have proven that our laser machines are stable inperformance with rare malfunction. However, we would like to handle it as follows oncemalfunction occurs:
a.We guarantee that we will give you a clear reply within 24 hours.
b.Customer service staff will assist and guide you to analyze the malfunction in order to locatethe cause.
c.If the malfunction is caused by improper operation on software and other soft faults, we willhelp solve the problem on line.
d.We will offer plenty of online supports, just like detailed technical and installation instructionsby email,video, telephone. (Training by team viewer)
