AOFEMTO Series Femtosecond Laser
| Model | Parameter Specification | Wavelength (nm) | Average Power (Watts) | Pulse Energy (µJ) | Specified Frequency (kHz) | Repetition Rate Range (kHz) | Beam Quality (M²) | Ambient Temperature (°C) | Power Supply Requirement (VDC/Watts) |
| AOFEMTO (UV Femtosecond) | 5W-100K | 355 | >5 | >50 | 100 | 50-300 | ≤1.2 | 15-35°C | 24/1000 |
| AOFEMTO (Green Femtosecond) | 10W-100K | 532 | >10 | >100 | 100 | 100K-1M | ≤1.2 | 15-35°C | 24/1000 |
| AOFEMTO (IR Femtosecond) | 20W-100K | 1064 | >20 | >200 | 100 | 10-1000 | <1.3 | 15-35°C | 24/1000 |
AOFEMTO Series femtosecond lasers offer compact design, high versatility, integrated analog power control, external trigger support, intelligent diagnostics, and excellent optical performance. Available in UV, Green, and Red wavelengths for precision industrial applications.
Product Pictures

Product Introduction
The AOFEMTO Series femtosecond laser line offers UV, Green, and Red wavelengths with a compact design and excellent versatility. Compared to previous generations, the footprint has been significantly reduced, while standardized dimensions across high-power picosecond and full-spectrum femtosecond lasers allow seamless replacement in existing systems.
AOFEMTO lasers provide rich functionality and ease of use, including integrated external analog voltage power control, external signal triggering, automatic crystal point switching, power and status monitoring, intelligent diagnostic recording, and pulse waveform editing.
Optical performance is outstanding, featuring excellent beam quality (M² < 1.1), customizable spot circularity (>95%), minimal astigmatism, precise focusing, and stable pulses. Ideal for precision micro-machining, industrial marking, and advanced packaging applications, the AOFEMTO Series combines compact size, versatility, and superior optical performance.
Application Cases
Femtosecond Laser Applications
Industrial Manufacturing & Precision Processing
Micro-structuring
Precision metal cutting
Thin film cutting and removal
Transparent material cutting (glass, sapphire, quartz)
3C electronics component processing (mobile phones, PCBs, FPCs)
Full-screen display glass cutting
Optical filter and component fabrication
Medical & Biological Applications
Medical device micro-machining
Precision surgical blade cutting
Tissue microdissection
Research & Advanced Optics
Photonics device fabrication
Optical microstructure fabrication
Surface functionalization
Material research and laboratory applications
Electronics & Consumer Products
OLED and LCD display cutting
Mobile phone antenna and antenna film cutting
Polyimide (PI) and P-layer film cutting
Electronic component marking
Specialized High-Difficulty Processing
Sapphire cutting
Complex-shaped glass cutting
Anti-corrosion and salt-spray marking


