High-Power Picosecond Laser Source – IR, Green & UV

JCZ high-power picosecond laser sources are designed for industrial micromachining systems that require short pulse duration, high average power and controlled pulse energy with reduced thermal impact.

The series covers 1064 nm infrared, 532 nm green and 355 nm ultraviolet configurations. Published models range up to 500 W in IR, 200 W in green and 100 W in UV, with model-dependent repetition rates up to 6 MHz, burst operation and external trigger control.

Selecting a picosecond laser should start with the material and process requirement—not maximum average power alone.

Choose the Wavelength Before Choosing Power

Actual process suitability depends on material composition, thickness, optics, spot size and required edge or surface quality.

High-Power Picosecond Laser Range

1064nm IR Picosecond Laser

The IR series covers published models from 15 W to 500 W.

Higher-power configurations are intended for applications where throughput and material-removal rate are important, while lower-power models may provide a more appropriate process window for fine micromachining.

Published high-power IR configurations include 80 W, 200 W and 500 W models.

532nm Green Picosecond Laser

The green series includes published 6 W, 30 W, 90 W and 200 W configurations.

Green wavelength should be evaluated where material absorption or process quality makes 1064 nm less suitable, including selected semiconductor, photovoltaic and display processes.

355nm UV Picosecond Laser

The UV range includes published 5 W, 20 W, 30 W, 60 W and 100 W configurations.

The shorter wavelength supports smaller optical feature sizes and can be advantageous for thin layers, PCB/FPC, displays, polymers and other precision processes where thermal input must be tightly controlled.

How to Compare Average Power, Pulse Energy and Repetition Rate

Average power alone does not define picosecond processing performance.

For example, a high-average-power MHz laser may deliver lower energy per individual pulse than a lower-average-power system operating at a lower repetition rate or in burst mode.

JCZ publishes pulse durations in the picosecond range, model-dependent pulse energies from µJ to mJ-class burst operation, and repetition rates extending into the MHz range.

For process development, specify the required material-removal rate and feature quality rather than selecting the highest wattage automatically.

Select a Picosecond Laser by Application

A successful process is determined by the complete combination of wavelength, pulse parameters, focusing optics and motion/scanning system.

Burst Mode and External Trigger Control

The published JCZ high-power picosecond laser range supports burst-mode operation on selected configurations.

Burst processing can deliver several closely spaced picosecond pulses within one pulse packet. Depending on the material and process, this can change material-removal efficiency and thermal accumulation compared with single-pulse operation.

Published system-control functions include:

• PSO triggering;
• POD triggering;
• Gate mode;
• TTL trigger;
• 0–5 V external power control.

These functions are relevant when integrating the laser source with galvo scanners, precision stages, PLCs or automated production equipment.

OEM Integration Requirements

Before integrating a high-power picosecond laser source, confirm the complete optical and electrical system.

Important inputs include:

• required wavelength;
• laser power and pulse energy;
• repetition-rate range;
• burst requirement;
• beam diameter and beam quality;
• focusing or scan optics;
• trigger and synchronization method;
• external power-control requirement;
• AC power availability;
• cooling-water specification;
• installation temperature and humidity;
• available machine space.

The current JCZ series uses water cooling and published models operate from AC 100–240 V / 50–60 Hz.

JCZ also provides galvo scanners, laser controllers and laser optics for laser-system integration.

Picosecond vs Nanosecond vs Femtosecond

Picosecond lasers are particularly useful when nanosecond processing produces unacceptable melting, burrs, chipping or thermal damage, but the application still requires industrial throughput.

The final choice should be based on tested process results rather than pulse duration alone.

What Affects the Picosecond Laser Configuration and Price?

Quotation varies with:

• IR, green or UV wavelength;
• average output power;
• required pulse-energy range;
• repetition-rate range;
• burst capability;
• beam-quality requirement;
• trigger and synchronization requirements;
• optical interface;
• cooling configuration;
• OEM integration requirements;
• order quantity.

High-power harmonic wavelengths such as green and UV also require different optical architectures from the fundamental IR output, so two systems with similar average power should not be assumed to have the same cost.

FAQ

Is a 500W picosecond laser always better than a 100W model?

No. Higher average power can increase throughput, but pulse energy, repetition rate, wavelength, spot size and material response determine whether the additional power is useful.

When should I choose a 355nm UV picosecond laser?

UV should be evaluated when shorter wavelength, finer optical focusing or stronger material absorption is useful for applications such as display, PCB/FPC, thin-film or thermally sensitive processing.

What is the difference between average power and pulse energy?

Average power is energy delivered over time. Pulse energy is the energy contained in an individual pulse or burst. Two lasers with similar average power can have very different pulse energies and therefore different processing behavior.

Why is repetition rate important?

Repetition rate changes the time between pulses, pulse overlap and energy deposited in the material. Higher frequency can support high-speed processing, but excessive pulse overlap can also change thermal accumulation.

What does burst mode change?

Burst mode delivers a group of ultrashort pulses instead of one isolated pulse. This can improve material-removal efficiency in some processes, but the optimum burst setting depends on the material and application.

Can the same optics be used for 1064nm, 532nm and 355nm?

Do not assume so. Optical coatings, focusing lenses, scanner mirrors and other beam-delivery components must be compatible with the selected wavelength and beam parameters.

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